references: - J.G. Hust and A.B. Lankford, Thermal Conductivity of Aluminum, Copper, Iron, and Tungsten from 1K to the Melting Point, US Department of Commerce, Boulder, Colorado, 1984, fit to Tab. 2.4.1 (RRR=1000, T_min=200K, T_max=1000K) - https://www.mit.edu/~6.777/matprops/copper.htm K_11: 4.039e+2 K_11,T: -8.119e-2 K_11,T^2: 1.454e-5 T_ref: 293.15 C_p: 385.0