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DAMASK_EICMD
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This commit is contained in:
Martin Diehl 2023-07-24 18:29:36 +02:00
parent dafd39566d
commit d953e6bedf
2 changed files with 7 additions and 5 deletions
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2
src/homogenization_damage.f90
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@ -158,7 +158,7 @@ module subroutine homogenization_set_phi(phi)
integer :: ho, en, ce integer :: ho, en, ce
do ce=1, ubound(phi,1) do ce=lbound(phi,1), ubound(phi,1)
ho = material_ID_homogenization(ce) ho = material_ID_homogenization(ce)
en = material_entry_homogenization(ce) en = material_entry_homogenization(ce)
damagestate_h(ho)%state(1,en) = phi(ce) damagestate_h(ho)%state(1,en) = phi(ce)

10
src/homogenization_thermal.f90
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@ -177,12 +177,14 @@ module subroutine homogenization_thermal_setField(T,dot_T)
real(pREAL), dimension(:), intent(in) :: T, dot_T real(pREAL), dimension(:), intent(in) :: T, dot_T
integer :: ce integer :: ho, en, ce
do ce=1, min(ubound(T,1),ubound(dot_T,1)) do ce=max(lbound(T,1),lbound(dot_T,1)), min(ubound(T,1),ubound(dot_T,1))
current(material_ID_homogenization(ce))%T(material_entry_homogenization(ce)) = T(ce) ho = material_ID_homogenization(ce)
current(material_ID_homogenization(ce))%dot_T(material_entry_homogenization(ce)) = dot_T(ce) en = material_entry_homogenization(ce)
current(ho)%T(en) = T(ce)
current(ho)%dot_T(en) = dot_T(ce)
call thermal_partition(ce) call thermal_partition(ce)
end do end do