DAMASK_EICMD/examples/config/phase/thermal/Cu.yaml

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references:
- J.G. Hust and A.B. Lankford,
Thermal Conductivity of Aluminum, Copper, Iron, and Tungsten from 1K to the Melting Point,
US Department of Commerce, Boulder, Colorado, 1984,
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fit to Tab. 2.4.1 (RRR=1000, T_min=200K, T_max=1000K)
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- https://www.mit.edu/~6.777/matprops/copper.htm
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output: [T]
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K_11: 4.039e+2
K_11,T: -8.119e-2
K_11,T^2: 1.454e-5
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T_ref: 293.15
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C_p: 385.0