DAMASK_EICMD/examples/config/phase/thermal/W.yaml

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2021-05-24 13:32:28 +05:30
references:
- J.G. Hust and A.B. Lankford,
Thermal Conductivity of Aluminum, Copper, Iron, and Tungsten from 1K to the Melting Point,
US Department of Commerce, Boulder, Colorado, 1984,
fitted to Tab. 5.4.1 (RRR=300, T_min=200K, T_max=1000K)
2021-07-14 00:16:50 +05:30
- https://www.mit.edu/~6.777/matprops/tungsten.htm
K_11: 1.758e+02
K_11,T: -1.605e-01
K_11,T^2: 1.160e-04
T_ref: 293.15
C_p: 132.51