DAMASK_EICMD/examples/config/phase/thermal/Cu.yaml

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references:
- J.G. Hust and A.B. Lankford,
Thermal Conductivity of Aluminum, Copper, Iron, and Tungsten from 1K to the Melting Point,
US Department of Commerce, Boulder, Colorado, 1984,
fit to Tab. 2.4.1 (RRR=300, T_min=150K, T_max=1000K)
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- https://www.mit.edu/~6.777/matprops/copper.htm
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output: [T]
K_11: 4.005e+2
K_11,T: -1.075e-1
K_11,T^2: 3.293e-4
K_11,T^3: -7.533e-7
K_11,T^4: 5.223e-10
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T_ref: 293.15
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C_p: 385.0